• Material Business

    The Materials Business involves in production and sale of semiconductor packaging materials. It comprises two business divisions, namely Leadframe and MIS substrates.

    The leadframe segment manufactures etched and stamped leadframes used by multinational chip manufacturers, independent integrated circuit assembly houses and consumer electronics manufacturers.

    In 2015, the Group set up ASM Advanced Packaging Materials Pte. Ltd. (“AAPM”) in Singapore to develop and manufacture molded interconnect substrates (“MIS”). ?MIS is a new technology serving as a cost-effective near CSP alternative to traditional leadframes and BGA substrates. ?